Delivering up to a staggering 2700 GFlop/s GFlops of performance, the DuraHPC 5-21 features high- performance multi-core Intel Xeon server-class processors, Nvidia latest Kepler GPGPUs, an optional integrated liquid cooling subsystem, and a shock/vibration-resistant solid state disk (SSD). Fitted with an ingress-protected aluminium chassis, hermetically sealed MIL-DTL-38999 connectors, and highly efficient thermal management scheme, the rugged DuraHPC 5-21 is designed to operate over extended temperature ranges and comply with MIL-STD-810G environmental and MIL-STD-461F EMI/EMC conditions.
Provided with different configuration options, the DuraHPC 5-21 is ideal for ground station operations, where it is an unparalleled solution to process signals from a variety of sensors, while it is possible to configure it to respect stringent power budgets like for the usage in unmanned vehicles or other drones.
Leveraging the underlying high performance computing (HPC) blade architecture of the Aurora hybrid supercomputers, but in a ruggedized and tightly integrated liquid-cooled chassis, the DuraHPC 5-21 is designed for data intensive tactical applications, including Digital Signal Processing (DSP), Intelligence, Surveillance, Reconnaissance (ISR), simulation/training, energy exploration, situational awareness, vehicle electronics and radar signal processing. All system processors are linked via Intels high bandwidth Quick Path Interconnect (QPI) with three channels of DDR3 memory connected to each CPU (up to 24GB DDR total). Each unit features low-latency Infiniband interconnectivity (or optional 10 Gigabit Ethernet) to support rugged parallel computing capabilities when more than one unit is connected together in a cluster.
The DuraHPC 5-21s CPU / GPGPU subsystem chassis has a 1U 19 rack-mount form factor and comes ready to connect to an external chiller/heat exchanger to support operating temperatures of up to -40ΊC to +Ί65C (-40ΊF to +145ΊF). To maximize computational performance in space-constrained applications, the units internal electronics are tightly coupled to an aluminum cooling plate that features sealed micro-channels and aerospace-grade inflow/outflow connectors to circulate water and efficiently extract heat from the unit. When mated with its companion liquid cooling subsystem, the system measures 2U in height is completely standalone and self-contained for use in climate controlled data center / labs or cold weather deployments.
HIGH PERFORMANCE
Up to 2700 GFlops Computational Performance
Dual 8-Core Intel Xeon E5 Processors @ Up to 3.1 GHz Clockspeed
Up to 128 GB Soldered Down DDR3 RAM for Faster Memory Access
High-Speed QDR 40Gbps Infiniband Interconectivity
Serial ATA (SATA) Solid State Disk Storage
HPC CLUSTER CAPABLE
Multiple Units Can be Connected Together to Form Powerful and Ruggedized Cluster Computer Solutions to Solve Demanding Computational Challenges
Infiniband Interconnects Guarantee Low Latency Communication Between Units in Switched Network, with a Larger Shared Memory Resource Pool
High-Density Form Factor Accommodates Traditional 19 Rack Mount
LIQUID COOLED
Computer Electronics Integrated to Aluminum Cold Plate with Sealed Water Circulation Channels and Aerospace-Grade Inflow/Outflow Connectors
Computing Unit Integrates with External Heat Exchanger/Chiller or Attached, Self-Contained Liquid Cooling Subsystem (with Circulation Pump, Fans and Heat Exchanger)
RUGGED MECHANICAL DESIGN
Designed for MIL-STD-810G Thermal, Shock, Vibration Conditions
Corrosion-Resistant, Aluminum Chassis Sealed Against Water, Dust, EMI
Circular MIL-DTL-38999 Connectors for Reliable I/O Connections
Designed to MIL-STD-461F Conducted/Radiated Emissions & Susceptibility
PROCESSOR
Performance: Up to 2700 GFlops Performance (1700 GFlops Based on High Performance Linpack HPL Benchmarks)
CPU: 2x Intel Xeon E5 Processors (Sandy Bridge), 6-8 Cores/12-16 Threads per Processor, 20MB Intel Smart Cache, 64-Bit Instruction Set, Up to 2.9 GHz Clockspeed (3.8 GHz w/ Intel Turbo Boost 2.0) with Support for Intel vPro, Hyper-Threading, Virtualization, Enhanced SpeedStep, Trusted Execution, Intel 64 Technologies
Companion Chipset: Intel I/O hub (Patsburg)
ACCELERATOR
GPGPU: 2 x Nvidia Kepler K20 small form factor, 4,992 CUDA cores, clock at 705 MHz (single-precision floating point performance at 2 x 3.52 TFLOP/s and double-precision 2 x 1.17 TFLOP/s), 5 GB GDDR5 memory - bandwidth of 200 GB/s.
MEMORY / STORAGE
DRAM: up to 128 GB of DDR3 RAM Three Channels Memory Connected to Each CPU, Soldered Onboard for Signal integrity, Faster Memory Access, Vibration/Shock Resistance
SSD: 80 GB Capacity (Up to 512 GB Supported) SATA 1.8 Solid State Disk (SSD), Vibration/Shock Proof, High Data Retention
SCALABILITY
Cluster Computing Node Capable Integrated Mellanox Infiniband ConnectX2 Device Provides Low-Latency Infiniband Connectivity to Implement Switched Network and Link to High Performance Data Storage
1U/2U Computing Server Modules Can Be Easily Grouped in 19 Racks
SOFTWARE
Operating System: Linux, Windows Server or Windows HPC Server
Compatible with Industry Standard Cluster Managers, Schedulers, File Systems, and Other HPC Tools
CONNECTIVITY & I/O
1x Infiniband, 10Gbps SDR Data Rate, <2s latency (Special Configuration up to QDR 40Gbps)
1x 10 Gigabit Ethernet Port (Special Order Option Only)
1x 10/100 Ethernet Management Port
1x EIA RS232 Serial Port
1x Analog Video Output (Up to 1600 pixels x 1200 pixels)
2x USB 2.0 Ports
THERMAL MANAGEMENT
Internal Cold Plate Fixed to Computer Motherboard Circulates Water Through Sealed Mirco-Channels using Aerospace-Grade Inflow/Outflow Connectors
Self-Contained 1U Liquid Cooling Subsystem with Heat Exchanger, Fans and Circulation Pump Option
Interface to External High Efficiency Heat Exchanger/Liquid Chiller for High Temperature Operation
POWER
28V Nominal Power Input Voltage (18-36VDC Range Continuous)
Vehicle Grade DC/DC Converter with Input Transient Protections (Reverse/Over Voltage, Surge, Filtering)
Power Dissipation: Maximum of 380 to 450 W for CPU Subsystem (Varies Based on Processor Series); ~300W to 1KW Max for Cooling Subsystem (Depending on Heater Usage at Low Temps)
ENVIRONMENTAL
Designed to Meet MIL-STD-810G: (Formal Qualification Testing Pending)
Operating Temperature (Cooling Device / Processor TDP Rating Dependent)
Up to -40 to +65C (-40ΊF to +145ΊF) Ambient with External High Efficiency Liquid Cooling Device
Up to -40 to +25C (-40ΊF to +77ΊF) Ambient with Integrated Liquid Cooling Subsystem (as Shown)
Storage Temperature: -40ΊC to +85ΊC (-40ΊF to +185ΊF)
Shock & Vibration: Designed for Vehicle / Aircraft Use
Water / Dust Ingress: CPU Subsystem Dust/Water Proof (Similar to IP67)
EMI / EMC
Designed to meet MIL-STD-461F for Conducted and Radiated Emissions and Susceptibility
OPTIONS
Starter Breakout Cable Sets from MIL-38999 Connectors for Lab Use
10 Gigabit Ethernet Interface
Multi-Unit HPC Clustered Configurations, including Professional Services to Configuring and Setting Up
Operating System, Cluster Managers, Schedulers, File Systems, and Other Considerations
Customized and Integrated Liquid Cooling Thermal Management Device
Physical Characteristics
Chassis: Aluminium Alloy, Corrosion Resistant with Black Anodize Finish
Connectors: MIL-DTL-38999, Series III, Hermetically Sealed; Industrial RJ-45
Installation: Compatible with 19 Rack Mount
Weight: 8.35 Kg (~ 18.41 lbs) Computer Subsytem; ~ 7.15 Kg (15.16 lbs) Cooling Subsystem
Dimensions: 1U Computer: 4.45cm (H) x 22.5cm (W) x 75cm (L) / ~1.34 (H) x 8.86 (W) x 29.53 (L);
Computer + Cooling Subsytem: 8.9cm (H) x 22.5cm (W) x 70cm (L) / ~3.50 (H) x 8.86 (W) x 29.53 (L)